International Conference
on Technological Innovation
& AI Research
March 19th to 21st, 2025

Published by

IET

Indexed by

Compendex
Scopus
SJR

Sponsors

welcome

Welcome to the International Conference on Technological Innovation and AI Research 2025

Connect with leading researchers and professionals at the International Conference on Technological Innovation and AI Research (ICTIAR2025). From March 19 to 21, 2025, engage in dynamic discussions on the latest advancements in AI, machine learning, and emerging technologies. This virtual conference offers a collaborative space for presenting groundbreaking research, exchanging insights, and shaping the future of innovation. Be part of the global conversation driving scientific progress..

for authors

Important Dates

  • Paper Submission Deadline

    December 01, 2024

  • Notification of Acceptance

    January 27, 2025

  • Camera Ready

    February 16, 2025

  • Conference Dates

    March 19 - 21, 2025

Guidelines

The papers must be prepared according to the IET Conference Paper Format. The papers must present scientifically sound research that is relevant to the scope of the conference, and written in clear, concise English.

You must adhere to the following guidelines:

  • Page Formatting: Authors must use the given Manuscript Template to prepare the paper.
  • Page Length: The paper should be between 4 and 6 double-column pages. Beyond this length, a charge per additional page will be applied. The maximum number of pages allowed is 8.
  • Language, Spelling and Grammar:Papers must be written in English. Ensure that the paper is spell checked.
  • Originality:Is the work scientifically rigorous, accurate, and novel? Does the work contain significant additional material to that already published? Has its value been demonstrated?
  • Plagiarism:All conference papers submitted to the IET for publication must record original work which has not been published previously. Any alleged cases of plagiarism will be dealt with according to the ‘IET Policy in Relation to Plagiarism, Infringement of Copyright and Infringement of Moral Rights and Submission to Multiple Publications’
  • Multiple submissions: The IET does not permit manuscripts included in its conference proceedings to be simultaneously under review for another conference or publication. Once a case of multiple submissions has been established, the paper/s in question will be immediately declined for publication by the IET.
  • Relevance: Is the material appropriate to the scope of the conference to which it is submitted?
  • Clarity: Is the English clear and well written? Poorly written English may obscure the scientific merit of your paper. Are the ideas expressed clearly and concisely? Are the concepts understandable?

For any issues related to the submission process, please, feel free to contact us: ictiair@tiacon.org

Proceeding Publication

All accepted papers from the conference will be published in the IET Conference Proceedings. Furthermore, the proceedings will be indexed by IET Inspec, EI Compendex and Scopus. All papers must be formatted according to the IET Proceedings format.

Review Process

  • All submitted papers will be reviewed by at least 2 independent reviewers. Additional reviewers will be consulted if required.
  • All papers will go through plagiarism checker. Plagiarism report must not exceed 15%
  • All papers must be formatted according to the given template.
  • Paper acceptance will be based on originality, significance, technical soundness, and clarity of presentation.
  • Authors must make sure that they submit previously unpublished papers to this conference.

Awards & Participation

  • All accepted papers that are presented will be awarded a presentation certificate.
  • The Best Paper certificate will be awarded to the author(s) of the best paper. The selection will be based on reviewers' comments and recommendations of the session chair.
topics

Topics of Interest

  • Computer Vision Applications
  • Deep and Reinforcement learning
  • Deep Learning & Neural Network Robotics
  • Distributed and decentralized machine learning algorithms
  • Distributed Intelligent Processing
  • Ethics in AI
  • Image and Video Retrieval
  • Image Processing & Computer Vision
  • Intelligent wireless communications
  • Medical Image Processing
  • Natural language processing (NLP)
  • Remote Sensing and Applications
  • Robotics and intelligent automation
  • Speech, Audio and Music Processing
  • Statistic Learning & Pattern Recognition
  • Architecture of Big Data
  • Architectures and systems of Cloud Computing
  • Big Data Analysis and Processing
  • Big Data in Smart Cities
  • Big Data Management
  • Edge Computing
  • Management and operations of Cloud Computing
  • Models and algorithms of Big Data
  • Models, Simulations, Designs, and Paradigms of Cloud Computing
  • Search, Mining and Visualization of Big Data
  • Security and Privacy of Big Data
  • Technologies, Services and Application of Big Data
  • Decarbonization and Carbon Capture Technologies
  • Electric Vehicles (EVs) and Infrastructure
  • Energy Efficiency and Demand Response
  • Grid Modernization and Equity
  • IoT advancements and smart infrastructure
  • Sustainable IT practices and renewable energy technologies
  • Architecture for secure IoT
  • Blockchain and Crypto Market Trends
  • Blockchain for Identity Management
  • Blockchain for security IoT
  • Cloud computing in the IoT
  • Data Compression in IoT Devices
  • Enterprise Blockchain Adoption
  • Intelligent Systems for IoT
  • Internet of things information security
  • Internet of things technology standard
  • IoT Services and Applications
  • Legal issues for Blockchain
  • Networking and Social Networks
  • Social Networks Analysis
  • Circular Economy
  • Engineering and Technology Skills for People and Organizations
  • Engineering Innovation and Entrepreneurship
  • Happiness Management
  • Innovation, Entrepreneurship & Venture
  • New business Models
  • New Markets for Entrepreneurs
  • Open Innovation
  • Operations Management
  • Social Implications of Technology
  • Technologies for Upskilling and Reskilling
  • Technology and Innovation Management
  • Technology Entrepreneurship
  • Technology for Entrepreneurship
  • Technology Policy Development and Assessment
  • Technology Transfer
  • Venture Capital Investment
  • AI and Machine Learning in Education
  • Augmented Reality (AR) and Virtual Reality (VR) in Education
  • EdTech and Inclusivity
  • E-Learning Platforms and Digital Classrooms
  • Future of Work and Education Alignment
  • Gamification and Interactive Learning
  • Learning Analytics and Data-Driven Education
Committee

Organizing Committee

Fausto Pedro García Márquez

Mariela Cerrada Lozada

Mónica Karel Huerta

René Vinicio Sánchez Loja

Roger Clotet

fees

Conference Fees

Authors

$ 300.00

  • 1 Paper
  • Additional page: +$50 per page (max 2 pages)
  • Additional paper: +$200 each

Attendees

$ 150.00

Student Attendees

$ 50.00

  • Registration must be with institutional email

Special Price for Sponsor Universities (UNEMI, VIU, or UCLM)

$ 50.00

  • Must register using institutional email
  • Attendee: $50
  • Student Attendee: Free
features

Why you should Join Event

Cutting-Edge Research

Delve into the latest advancements in Artificial Intelligence, Machine Learning, Big Data, and more. Present and discuss innovative solutions shaping the future of technology.

Global Networking

Meet and collaborate with global thought leaders, top researchers, and industry professionals. Forge valuable connections that could lead to future partnerships and joint projects.

Renowned Speakers

Gain insights from internationally recognized experts in AI and technology, including keynote addresses from leading voices in research, academia, and industry.

Learn from Industry Experts

Get exclusive access to keynotes and sessions led by world-renowned experts in artificial intelligence and technology. Learn directly from those pushing the boundaries of innovation.

Publish in Prestigious Journals

Submit your research for a chance to be published in SCOPUS and COMPENDEX indexed journals, gaining international recognition and elevating your academic profile.

Join from Anywhere

With our fully virtual event, you can participate from any location, making it easier than ever to attend sessions, engage in discussions, and present your work.

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